The GL8 MLA Gen2 is GermanLitho’s latest semi-automatic UV nanoimprint lithography equipment developed specifically for Wafer Level Optics (WLO) processes, capable of parallel imprinting polymer micro- and nano-optic components on up to 200 mm wafers.
The GL8 MLA Gen2 supports automatic replication of flexible composite working stamps, characterized by high-resolution and a long service life, from wafer level master molds, significantly reducing the cost of large-area molds in nanoimprint processes. The integrated high-precision automatic resist dispensing system, APC (Active mold/substrate Parallel Control) technology, and automatic separation functions guarantee fidelity, uniformity (TTV), and yield for large-area wafer level optics production. The automatic alignment system enables Wafer Level Stacking (WLS) processes. The GL8 MLA Gen2 is suitable for development and pilot production of DOEs, Diffusers, MLAs, Fresnel lenses and myriad other products.
Volume-proven UV-nanoimprint equipment for Wafer Level Optics processes.
APC (Active mold/substrate Parallel Control) technology guarantees large-area TTV uniformity of imprinted wafers.
Automatic internal replication of flexible composite working stamp, reducing the cost of large-area molds in nanoimprint processes.
Automatic high-precision resist dispensing function.
Automatic nanoimprinting processes including working stamp replication, alignment, imprinting, curing and separation.
High power UV LED panel (365nm, light intensity >1000mW/cm2) with water cooling, light sources of different power and wavelength can be provided according to customer specifications, perfectly supporting a variety of commercial nanoimprint materials.
Mini-environment and electrostatic elimination device equipped as standard.
Based on our experiences, we have created nanoimprint process and material starter-kits to be delivered with our products, enabling our customers to immediately make use of the world-leading level of nanoimprint technology.
Substrate size |
2inch, 100mm, 150mm, 200mm (Special sizes can be customized) |
Substrate material |
Silicon, glass, quartz, plastic, metal, etc. |
Wafer loading & unloading |
Single wafer automatic loading and unloading |
Wafer pre-alignment |
Optical pre-alignment |
Supported NIL process |
UV-NIL with APC (Active mold/substrate Parallel Control) technology, suitable for large area WLO, WLS and other processes |
Resolution |
Higher than 10 nm* |
Aspect ratio |
Greater than 10: 1* |
TTV control |
Micrometer accuracy (200mm wafer) * |
UV curing light source |
High power UV LED panel light source (365nm), light intensity >1000mw/cm2, water cooling, (2000mw/cm2 optional） |
Mini-environment and climate control |
Standard, external environment class 100, internal environment better than class10* |
Automatic imprinting |
Supported |
Automatic separation |
Supported |
Automatic resist dispensing |
Supported |
Automatic working stamp replication |
Supported |
Automatic alignment |
Optional |