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200/300 mm Fully-automatic nanoimprint lithography mass production system Next Prev < Return

GL300 Cluster
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The GL300 Cluster is a modular, fully-automatic nanoimprint lithography mass production system combining all related NIL pre-process steps including wafer cleaning, plasma surface treatment, resist spin-coating, baking, cooling and full-field UV-NIL into a single platform for 200/300mm wafers.

GermanLitho’s proprietary CLIV (Contact Litho into Vacuum) technology guarantees the accuracy and replication fidelity of imprinted structures. The GL300 Cluster enables fully-automatic mass production of high-resolution (Higher than 10nm*), high-aspect-ratio (Greater than 10: 1 *) nanostructures. The modular design allows users to freely configure for cleaning, coating, baking, cooling, plasma surface treatment, AOI inspection, Post Cure, and nanoimprinting according to their individual process requirements and production cycle time, achieving optimal production efficiency. From the replication and exchange of flexible composite working stamps, to NIL wafer pre-processing and high-resolution nanoimprinting, all process steps are carried out full-automatically in a closed and clean mini-environment, to guarantee the imprinting quality. The GL300 Cluster nanoimprint system is suitable for large-scale mass production of DOEs, AR/VR waveguides (including slanted gratings), WGPs, metalenses, biochips, LED PSSs, MLAs and myriad other products.

Major function

  • Volume-proven fully-automatic 200/300mm nanoimprint lithography mass production system for high-resolution, high-aspect-ratio nanostructures.

  • CLIV technology guarantees the accuracy and replication fidelity of imprinted structures.

  • Cassette to cassette automatic wafer loading/unloading and optical pre-alignment. 

  • Automatic flexible composite working stamp replication and working stamp loading/unloading, suitable for mass production.

  • Fully-automatic NIL substrate pretreatment processes, including substrate cleaning, spin-coating, baking, cooling and optional plasma surface treatment.

  • Fully-automatic nanoimprinting processes, including working stamp replication, alignment, imprinting, curing and separation.

  • All process steps are carried out in a closed and clean mini-environment, to guarantee imprinting quality.

  • High power UV LED panel (365nm, light intensity >1000mW/cm2) with water cooling, light sources of different power and wavelength can be provided according to customer specifications, perfectly supporting a variety of commercial nanoimprint materials.

  • Throughput of up to 100 wph, suitable for large-scale mass production of DOEs, AR/VR waveguides (including slanted gratings), WGPs, metalenses, biochips, LED PSSs, MLAs and myriad other products.

  • Based on our experiences, we have created nanoimprint process and material starter-kits to be delivered with our products, enabling our customers to imm

Equipment photos

GL300 CLuster.png

Related parameters

Substrate size

200mm (open cassette, customized SMIF) / 300mm (FOUP)

(Special sizes can be customized)

Substrate material

Silicon, glass, quartz, plastic, metal, etc.

Wafer loading & unloading

Cassette to cassette automatic loading/unloading

Wafer pre-alignment

Optical pre-alignment

Supported NIL process

UV-NIL with GermanLitho proprietary CLIV (Contact Litho into Vacuum) technology ensures the accuracy of imprinted structures and replication fidelity, suitable for imprinting of high resolution, high aspect ratio nanostructures

Pre-treatment process steps for nanoimprint

Wafer Cleaning (brush, two-fluid, megasonic), spin-coating, baking, cooling, Plasma surface treatment etc.

Resolution

Higher than 10 nm*

Aspect ratio

Greater than 10:1*

Residual layer thickness(RLT)

Less than 10nm*

UV curing light source

High power UV LED panel light source (365nm)

light intensity >1000mW/cm2 , water cooling, (2000mW/cm2 optional)

Mini-environment and climate control

Standard, external environment class 100, internal environment better than class 10*

Automatic imprinting

Supported

Automatic separation

Supported

Automatic working stamp replication

Supported

Automatic working stamp exchange

Supported

Automatic alignment

Optional

Post Cure

Optional

Online AOI inspection

Optional

Throughput

Up to 100 wph*


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